Research on characterization of stretchability for metal universal interconnect structure in stretchable eletronics

ZUO Feng, PAN Kailin, QIN Qing, YANG Fan, JIANG Tingbiao

(Mechanical and Electrical Engineering College, GuiLin University of Electronic Technology
 GuiLin 541004,China)

Abstract: Aimed at a series of problems of interconnect structure such as complexity of performance analysis and uncertainty of structure design in stretchable eletronics, a universial interconnect structure, through which common interconnect structures can be formed by changing its geometric parameters was proposed by the means of summary and analysis of the common structures. Based on the beam structure theory and aimed at the proposed structures, tensile displacement and bending displacement formula were derived by energy method in free condition. Furthermore, their corresponding tensile stiffness and bending stiffness were calculated according to Hooke's law and combining the displacement formula above. The finite element numerical simulations model were built to verify the validity and generality of the stiffness formula. Finally the validation results indicate that the tensile stiffness and bending stiffness formula of universal interconnect structure is correct and characterization of stretchability for universal interconnect structure is proved. This research provide a meaningful design guide for interconnect structure design.

Key words: stretchable electronics; metallic conductors; universal interconnect structure; tensile stiffness; bending stiffness;