《机电工程》杂志,月刊( 详细... )
中国标准连续出版物号: ISSN 1001-4551 CN 33-1088/TH
主办单位:浙江省机电集团有限公司
浙江大学
主编:陈 晓
副 主 编:唐任仲、罗向阳(执行主编)
总 经 理:罗向阳
出 版:浙江《机电工程》杂志社有限公司
地 址:杭州市上城区延安路95号浙江省机电集团大楼二楼211、212室
电话Tel:+86-571-87041360、87239525
E-mail:meem_contribute@163.com
国外发行:中国国际图书贸易总公司
订阅:全国各地邮局 国外代号:M3135
国内发行:浙江省报刊发行局
邮发代号:32-68
广告发布登记证:杭上市管广发G-001号
在线杂志 |
当前位置: 机电工程 >>在线杂志 |
集成电路版图中的多边形匹配比较研究
作者:史峥,高晓莹,任杰,施怡雯 日期:2007-10-25/span> 浏览:3788 查看PDF文档
集成电路版图中的多边形匹配比较研究
史峥,高晓莹,任杰,施怡雯
(浙江大学 超大规模集成电路设计研究所,浙江 杭州 310027)
摘要:光学邻近校正是最重要的分辨率增强技术,而对光学邻近校正后的版图修正逐渐成为提高集成电路版图质量的必需步骤。提出了一种用于postOPC版图(做过OPC的版图)修正的多边形匹配比较的线性算法。算法通过比较preOPC和postOPC的版图,提取OPC校正时的分段信息和段偏移量,使得postOPC版图的修正能够充分利用前次OPC的结果,避免了重做OPC,提高了OPC验证后修正的效率。
关键词:可制造性设计;光学邻近校正;分辨率增强技术;多边形匹配比较
中图分类号:TN305文献标识码:A文章编号:1001-4551(2007)10-0032-04
Design of polygon matching and comparison in IC layout
SHI Zheng, GAO Xiaoying, REN Jie, SHI Yiwen
(Institute of VLSI Design, Zhejiang University, Hangzhou 310027, China)
Abstract: Optical proximity correction (OPC) is the most important RET and postOPC fixing technique has become a necessary process to improve the OPC quality. A liner polygon matching and comparison algorithm for postOPC fixing technique were presented. By comparing the preOPC and postOPC layout, it recognized and recorded the fragmentation and offset information. Therefore the postOPC fixing process can reuse the previous OPC result. By avoiding redoing OPC allover again, the entire processing efficiency was highly improved.
Key words: design for manufacturability (DFM); optical proximity correction (OPC); resolution enhancement technique (RET); polygon matching and comparison
参考文献(Reference):
[1]SCHELLENBERG F M, et al. Resolution Enhancement Technology: The Past, the Present, and Extensions for the Future[C]//Proceedings of SPIE Vol. 5377, Optical Microlithography XVII, Bellingham, WA: [s. n.], 2004:1-20.
[2]WANG X, PILLOFF M, TANG H, et al. Exploiting hierarchical structure to enhance cellbased RET with localized OPC reconfiguration[C]//Proceedings of SPIE Vol. 5756, Design and Process Integration for Microelectronic Manufacturing III: [s. n.], 2005:361-367.
[3]GUPTA P, HENG F L, LAVIN M, et al. Merits of cellwise modelbased OPC[C]// Proceedings of SPIE Vol. 5379, Design and Process Integration for Microelectronic Manufacturing II, Bellingham, WA: [s. n.], 2004:182-189.
[4]MORSE R D, LOPRESTI P, CORBETT K, et al. Using reconfigurable OPC to improve quality and throughout of sub-100nm IC manufacturing[C]// Proceedings of SPIE Vol. 6154, Optical Microlithography XIX: [s. n.], 2006:61543D,1-8.
[5]ZHANG Y P. Simulation based data processing using repeated pattern identification[C]//Proceedings of SPIE Vol. 5042, Design and Process Integration for Microelectronic Manufacturing II: [s. n], 2003:87-98.
[6]ZHANG H B, SHI Z. SOFT: smooth OPC fixing technique for ECO process[C]//Proceedings of SPIE Vol. 6521, Design for Manufacturability through DesignProcess Integration, USA: [s. n], 2007:65211H,1-9.
友情链接