Analysis of pressure loading system for chip polishing machine

ZHAO Wen-hong1， ZHOU Hai-jun1， SONG Chuang2， CHENG Cheng-yuan1，
XU Le-jun1， YUAN Ju-long1
（1.  Ministry of Education & Zhejiang Province Key Laboratory of E&M，
Zhejiang University of Technology， Hangzhou 310014， China；
2. College of Computer and Information Engineering， Lishui University， Lishui 323000， China）

Abstract： In order to realize the precise，multi-mode control of polishing pressure for getting a high planeness and no damaging super-smooth surfaces in wafer's double-sided polishing processing，a polishing pressure loading system which based on stepping motor was put forward. After the analysis of system's composition and principle，the mathematical modeling was established. A method of simulation in Simulink was presented to analyze its performance. The real control effects of polishing pressure were evaluated on the processing experiment of quartz wafer，the accuracy and stability of the polishing pressure loading system were tested. The experimental results show that the pressure loading system based on stepping motor is feasible and it can get a smooth polishing surface of wafers in polishing processing.
Key words： stepping motor； pressure loading； mathematical modeling