Thermal analysis TMP thermal design based on high-power LED

ZHAO Min， CHEN Zhi-ping， ZHANG Ju-yong
（College of Mechanical Engineering， Hangzhou Dianzi University， Hangzhou 310018， China）

Abstract： In order to solve the heat dissipation problems of high-power LED lamp，a high-power LED lamp without any optimization was simulated with ICEPAK software. The result shows that the temperature of the chip is 76.23 ℃ while it is limited at 80 ℃. Some improved thoughts were proposed aimed at solving this problem. At first，the heat sink size was designed and optimized，and the influence of the interfacial materials on chip temperature was researched. Then some improved structures such as heat pipe，fans and vapor chamber on heat sink were designed. The result shows that， by using appropriate improvement methods, the lamps junction temperature can be reduced significantly.
Key words： high-power LED；ICEPAK；thermal simulation