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Thermal analysis and optimization of array high-power LED lamp

Published:2015-04-08 author:LIAO Shao-kai1，MEI Fu-liang1，LIN Guang-ping1，WEI Tan-lin2 Browse: 2995 Check PDF documents

Thermal analysis and optimization of array high-power LED lamp

LIAO Shao-kai1，MEI Fu-liang1，LIN Guang-ping1，WEI Tan-lin2

（1. College of Civil Engineering ＆ Architecture，Jiaxing University，Jiaxing 314001，China；

2. Chuangzheng explosion proof ＆ Electric Appliance Co.，Ltd. Jiaxing 314000，China）

Abstract：Aiming at the cooling safety problem of the lamp in petrol-chemical field. The cooling properties of array high power LED

lamp was analyzed systematically. Basing on basic theory of heat transfer，through numerical simulation and curve fitting，the temperature

field model of the LED lamp was established in non- steady state，the quantitative relationship between chip temperature and light

material，area of endothermic plate and shell heat sinks was calculated，and an optimization model which aimed to reduce chip

temperature was set up，then optimized parameters of this LED lamp cooling structure was got. According to the dimensions of the cooling

structure，the LED lamp sample was made，and working temperature of the sample was tested. The results indicate that the numerical

simulation result is consistent with tested data，and the lamp junction temperature can be reduced significantly by array chips

arrangement and optimized cooling structure.

Key words：thermal analysis；high power LED light；simulation；optimization

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