JIN Yi fan1, WAN Yi1, ZHANG Bing2, REN Bing1

 

（1.Key Laboratory of High efficiency and Clean Mechanical Manufacture， School of Mechanical Engineering， Shandong

 University， Jinan 250061, China；2.Shandong Special Equipment Inspection Institute, Jinan 250101, China）

 

 

Abstract: Aiming at solving layer displacement and collapse problem of the deep slope and small cross section structure caused by poor cooling condition during the fused deposition modeling (FDM) 3D printing process, the problems existing in the traditional PID temperature control method were analyzed. A power adjustable semiconductor refrigeration system was developed based on semiconductor refrigeration technology. Finally, experiment was conducted at different cooling conditions and the piece angle range of layer displacement and collapse was measured to contrast. The results indicate that the cold end of the system designed can reach as low as 3.1℃ and the temperature of hot end is controlled below 65℃, which can improve the cooling conditions, and the piece angle range of layer displacement and collapse using the designed system can be reduced by 50% than that of natural condition and by 25% than that of fan cooling.

 

Key words: semiconductor refrigeration; fused deposition modeling (FDM); deep slope and small cross section; temperature control