JI Meng tuo, HONG Tao, WEN Dong hui, CHEN Zhen zhen, CAI Dong hai

(Key Laboratory of E&M, Ministry of Education, Zhejiang University of Technology, Hangzhou 310014, China)

 

Abstract: The distribution of particle sliding trajectories on wafer surface possessed great importance in the machined work piece surface quality. Aiming at the problem that particle sliding trajectories with rational rotational speed ratio was periodic, the trajectory simulations were carried out based on the kinematic analysis. Numerical simulations of particle sliding trajectories were performed to examine the influence of the kinematic parameters on the polishing uniformity of typical rotary type lapping equipment. A method of plane lapping with irrational rotational speed ratio was presented. The kinematic analysis and numerical calculation were used to discuss the effect of the rotating speed ratio on the trajectory uniformity by using Matlab and the lapping plate with preferred helix arrangement of fixed particle was selected. The results indicate that the trajectory distribution with irrational rotational speed ratio is more intensive and complicate than that with rational rotational speed ratio. For different irrational rotational speed ratio, the uniformity of trajectory distribution increases with increasing of rotational speed ratio gradually but it is more uniform with increasing of lapping time. The research provides theoretical guide to the design and development of new plan lapping equipment with condition of irrational rotating speed ratio.

Key words: plane lapping; particle trajectory; irrational rotational speed ratio; trajectory uniformity