Simulation and experimental of grinding softbrittle lithium niobate crystals
HU Tianming, KONG Fanzhi , GONG Yan, HONG Tao
(Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou 310014, China)
 

Abstract: Aiming at solving the problems of lithium niobate chip while grinding, the reason for fracture of lithium niobate chip in experiment was briefly proposed with crystallographic options. Finite element analysis method using COMSOL Multiphysics was empolyed for simulating grinding lithium niobate crystals. To simulate the process of grinding and thinning lithium niobate chip, its deformation and stress when grinding were analyzed under seven kinds of thickness for lithium niobate chip. Also grinding lithium niobate chip under electric load was simulated.The results indicate that deformation displacement of lithium niobate chip is gradually decreased while grinding under no electric load and the stress of four symmetric area on lithium niobate chip is much bigger when its thickness was 80 μm, which are inclined to fracture. And the results also show that deformation and stress concentration of lithium niobate chip is degraded which under electric load.
Key words: lithium niobate; COMSOL Multiphysics; grinding; finite element simulation; fracture