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International Standard Serial Number:
ISSN 1001-4551
Sponsor:
Zhejiang University;
Zhejiang Machinery and Electrical Group
Edited by:
Editorial of Journal of Mechanical & Electrical Engineering
Chief Editor:
ZHAO Qun
Vice Chief Editor:
TANG ren-zhong,
LUO Xiang-yang
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Chocolate 3D print modeling conditions based on semiconductor refrigeration
ZHOU Shihao1, TAN Yuegang1, ZHANG Fan1, CHEN Fei2, JIANG Shiqi2
(1.School of Mechanical and Electronic Engineering, Wuhan University of Technology, Wuhan 430070, China;
2. School of Information Engineering, Wuhan University of Technology, Wuhan 430070, China)
Abstract: Aiming at limited height of the Chocolate 3D printing when the temperature of natural environment is high, chocolate 3D printing modeling conditions was studied, the optimum modeling temperature of chocolate 3D printing is from 10 centigrade to 16 centigrade, and on this basis, from the view of thermodynamic simulation using fluent,3D printing modeling environment was constructed by adopting semiconductor refrigeration method, the relationship among multiple factors of the housing space and the power of semiconductor coolers that affect the modeling conditions, including the influence of ambient temperature on the modeling conditions were analyzed, and the design basis of chocolate 3D printer was reached. 3D printing comparative experiments of whether installing semiconductor coolers through certain housing space and at ambient temperature were conducted, which verifies the validity of the design. The results indicate that semiconductor refrigerator can greatly improve the chocolate 3D printing modeling conditions, as well as solve the problem of Chocolate 3D printing modeling height under the condition of natural environment.
Key words: chocolate 3D printing; modeling conditions; semiconductor refrigeration