Novel analytical looped package line structures for flexible electronics
                                                                    LI Zhouping, WANG Longfei
            (Department of Numerical Control Engineering, Shanxi Institute of Technology, Xi’an 710300, China)

Abstract: Aiming at the problem that the flexible electronic layer and structure can not be applied to the straight line product, a new flexible electronics looped package linestructure was proposed which is composed of silicon and polymer,the plane applicationturns to the linear application was achieved.The stress / strain of siliconmaterial was reduced by a polymer package, the linear equation of each region of the structure was established by using the classical mechanics theory,the analytical solution of the structure was solved by the principle of virtual work and the boundary conditions.A finite element model was designed to obtain finite element solution according to simulation experiment analysis.The analytical solution was compared with the finite element solution to verify the correctness of the theoretical model.The results indicate that the values of strain in silicon region approach to zero and guarantee the active device area can work normally.The structure is less influenced by external force and torque, and has a high structural stability and good performance.

Key words: flexible electronics; loopedpackage linestructures; stress/ strain