Study on the hole edge of hard and brittle materials based on ultrasonic vibration assisted grinding
TAN Li-na, BAI Bing
(Engineering Branch, Changchun Vocational Institute of Technology, Changchun 130000, China)
Abstract: Aiming at the problem of edge chipping in grinding of hard and brittle materials, the situation of hole edge chipping in processing of zirconia ceramics was studied. The ABAQUS was used to simulate the ultrasonic vibration assisted grinding of zirconia ceramic hole machining. And the zirconia ceramic JH2 constitutive model was established to study the formation mechanism of the hole chipping. Combined with finite element simulation results, ultrasonic vibration assisted grinding of zirconia ceramic hole machining experiments was designed. By establishing the evaluation index of the hole chipping, the influence of the spindle speed, feed rate and ultrasonic power on the hole chipping was analyzed and the simulation results were verified. The results show that the average error of chipping area between simulated and experimental is less than 10%. As the spindle speed and ultrasonic power increase, the hole chipping condition is significantly improved. Under the condition of 100% ultrasonic power, the area of chipping is reduced by more than 38%, and the area of hole chipping is obviously increased with the increase of feed rate.
Key words: ultrasonic vibration; hard and brittle materials; grinding; finite element simulation