International Standard Serial Number:

ISSN 1001-4551

Sponsor:

Zhejiang University;

Zhejiang Machinery and Electrical Group

Edited by:

Editorial of Journal of Mechanical & Electrical Engineering

Chief Editor:

ZHAO Qun

Vice Chief Editor:

TANG ren-zhong,

LUO Xiang-yang

Tel:

86-571-87041360,87239525

Fax:

86-571-87239571

Add:

No.9 Gaoguannong,Daxue Road,Hangzhou,China

P.C:

310009

E-mail:

meem_contribute@163.com

The past, present and future of temperature and pressure reducing device
Published:2021-11-23 author:XU Yi-xiang, QIAN Jin-yuan, CHEN Li-long, et al. Browse: 922 Check PDF documents
The past, present and future of temperature and pressure reducing device


XU Yi-xiang1, QIAN Jin-yuan1,2, CHEN Li-long3, JIN Zhi-jiang1


(1.Institute of Process Equipment, Zhejiang University, Hangzhou 310027, China;2.State Key 

Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou 310027, China;

3.Hangzhou Worldwides Valve Co., Ltd., Hangzhou 311122, China)


Abstract:  In view of the fact that the performance parameters of the current temperature and pressure reducing device were difficult to satisfy the requirements of complex working conditions such as high temperature, high pressure, and large flow in the future, the research status of temperature and pressure reducing device was investigated from different structural forms. Based on the development history of temperature and pressure reducing devices at home and abroad, two types of temperature and pressure reducing devices were introduced, one was integral type and the other was split type. Taking the pressure reducing mechanism, the temperature reducing mechanism, and the integrated temperature and pressure reducing mechanism as the main objects, the development history of temperature and pressure reducing devices in China in terms of structure optimization and parameter improvement were reviewed. Focus on noise, vibration, sealing, material and so on, the development direction of high parameter, fine and intelligent was put forward. The research results show that the development and research trend of temperature and pressure reducing device in the future includes supercritical flow analysis of steam in temperature and pressure reducing device, design and optimization of sealing structure of temperature and pressure reducing device, noise reduction and vibration reduction technology of temperature and pressure reducing device under complex working conditions, design and optimization of a new structure of temperature reducing mechanism and temperature and pressure reducing valve under complex working conditions.

Key words:  temperature and pressure reducing device; pressure reducing valve; temperature reducing mechanism; temperature and pressure reducing valve; structural design


XU Yi-xiang, QIAN Jin-yuan, CHEN Li-long, et al. The past, present and future of temperature and pressure reducing device[J].Journal of Mechanical & Electrical Engineering, 2021,38(9):1081-1090,1123.

  • Chinese Core Periodicals
  • Chinese Sci-tech Core Periodicals
  • SA, INSPEC Indexed
  • CSA: T Indexed
  • UPD:Indexed

Copyright 2010 Zhejiang Information Institute of Mechinery Industry All Rights Reserved

Technical Support:Hangzhou Bory science and technology

You are 1895221 visit this site